Thermally Activated Point Defect Migration in Copper
نویسندگان
چکیده
منابع مشابه
Dislocation mechanism of interface point defect migration
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ژورنال
عنوان ژورنال: Physical Review
سال: 1960
ISSN: 0031-899X
DOI: 10.1103/physrev.120.411